Power electronics unit having an integrated current sensor for forming a module; and drive train

ABSTRACT

A power electronics unit (1) for an electric drive unit, having an electrically conductive carrier element (2) and a power semiconductor module (3) arranged on the carrier element (2). The power semiconductor module (3) is designed to convert a direct current into a three-phase alternating current, and a current sensor (4) used to determine the alternating current is integrated such that it forms a main module (5) with the carrier element (2) and the power semiconductor module (3). A drive train for a motor vehicle having such a power electronics unit (1) is also provided.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.17/050,486, filed Oct. 26, 2020, which is a 371 National Phase ofInternational Application PCT/DE2019/100052, filed Jan. 21, 2019, whichclaims priority to German Patent Application No. 10 2018 109 803.0,filed Apr. 24, 2018, the entire contents of which are incorporatedherein by reference as if fully set forth.

TECHNICAL FIELD

A power electronics unit for an electric drive, e.g., a fully orpartially electric drive train of a motor vehicle, having anelectrically conductive carrier element and a power semiconductor modulearranged on the carrier element, wherein the power semiconductor moduleis designed to convert a direct current into a three-phase alternatingcurrent. A drive train having an electric motor and the powerelectronics unit electrically connected to this electric motor is alsoprovided.

BACKGROUND

Prior art of the generic type is known, for example, from KR 20150141404A, by which basic power electronics are disclosed.

Thus, power electronics are already known that convert a direct current(DC) from a battery into a three-phase alternating current (AC) for anelectric motor. Power semiconductor modules, for example, are used forthis conversion.

However, in the embodiments known from the prior art, it has been foundto be disadvantageous that the known power electronics units are oftenconstructed in a relatively complex manner. In particular, if a currentis also to be measured, the current sensors are usually connected asseparate component units behind the power semiconductor module. As aresult, a relatively large amount of installation space is required andthe manufacturing effort is relatively high.

SUMMARY

Therefore, the object of the present disclosure is to eliminate thedisadvantages known from the prior art and, in particular, to provide apower electronics unit which, on the one hand, allows reliable currentmeasurement and, on the other hand, is designed in as compact a manneras possible.

This is achieved according to an embodiment in that a current sensorused to determine the alternating current (in its magnitude) isintegrated in such a way that it forms a (common) main module with thecarrier element and the power semiconductor module.

Thus, the power semiconductor module is in turn assembled in a modularmanner together with the current sensor. This enables a particularlycompact design of the combination of the power semiconductor module andthe current sensor. On the one hand, the structure is as compact aspossible and, on the other hand, it can be manufactured as simply aspossible.

Further advantageous embodiments are explained in more detail below.

Accordingly, it is also advantageous if the current sensor iselectrically connected to a power semiconductor of the powersemiconductor module. This makes the construction even more compact.

If the current sensor is mechanically connected directly to the carrierelement, the structure can be further simplified.

In this connection, it is also useful if the current sensor is applieddirectly to the carrier element. This results in an integration of thecurrent sensor at the chip level. This further reduces the manufacturingeffort.

Alternatively to attaching the current sensor directly to the carrierelement, it is also advantageous if the current sensor is indirectlymechanically connected to the power semiconductor module and/or thecarrier element. This further simplifies the manufacturing effort.

In connection with this, it is also useful if the current sensor isattached to a conductor rail and the conductor rail is furtherelectrically and/or mechanically connected to the carrier element and/orthe power semiconductor of the power semiconductor module.

If the current sensor is arranged outside or inside a substantiallyrectangular outer contour of the carrier element or partiallyoverlapping with this outer contour, a suitable compromise between acompact design and easy production is implemented.

The power semiconductor module is furthermore preferably enclosed by amodule housing so that the efficiency and the service life of the powerelectronics unit are significantly extended.

In connection with this, it is again useful if the current sensor isalso arranged/integrated into the module housing. A particularly compactconstruction is thus achieved. Alternatively, it is also advantageous toarrange the current sensor in a sensor housing designed separately fromthe module housing (preferably outside of the module housing). Thissimplifies the assembly.

The power semiconductor module is preferably implemented as an IGBTmodule, i.e., a modular bipolar transistor with an insulated gateelectrode. This makes the construction particularly efficient.

If the carrier element is implemented as a lead frame, the manufacturingeffort is again significantly reduced.

A drive train (preferably a purely electromotive/electric drive train,more preferably a hybrid drive train) for a motor vehicle is alsoprovided, having a power electronics unit electrically connected to anelectric motor according to at least one of the embodiments describedabove. The power electronics unit is also preferably electricallyconnected to a battery. The power electronics unit is thus designed inprinciple for the field of application of the motor vehicle, but infurther embodiments it can also generally be designed for otherapplications in which the power electronics unit designed as acorresponding AC converter can be used.

In other words, a current sensor is thus integrated into a power module(power electronics unit). The current sensor is attached/integrated intothe power semiconductor module by connection technology or is arrangedon a chip level by integration.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments will now be explained in more detail below withreference to the figures in connection with various exemplaryembodiments.

In the figures:

FIG. 1 shows a plan view of a power electronics unit according to afirst exemplary embodiment in various states of assembly, wherein onlyone power semiconductor module is applied to a carrier element in theuppermost partial illustration of FIG. 1 , additionally a current sensoris connected to the power semiconductor module via a conductor rail inthe central partial illustration of FIG. 1 , and a module housingadditionally encloses the power semiconductor module in the lowerpartial illustration of FIG. 1 ,

FIG. 2 shows a plan view of the assembly of a current sensor and aconductor rail used in FIG. 1 ,

FIG. 3 shows a plan view of an assembly from the carrier element, thepower semiconductor module and the module housing, as they are used inFIG. 1 ,

FIG. 4 shows a plan view of a power electronics unit according to asecond exemplary embodiment in various states of assembly, wherein onlythe current sensor is connected to the carrier element via the conductorrail in the upper partial illustration of FIG. 4 , additionally thepower semiconductor module is attached to the carrier element in thecentral partial illustration of FIG. 4 , and the module housing is alsopresent in the lower partial illustration of FIG. 4 , and

FIG. 5 shows a plan view of a power electronics unit according to athird exemplary embodiment in various states of assembly, wherein thepower electronics module is only present on the carrier element in theupper partial illustration of FIG. 5 , the current sensor is stilldirectly applied to the carrier element in the central partialillustration of FIG. 5 , and the module housing is attached both aroundthe power semiconductor module and around the current sensor in thelower partial illustration of FIG. 4 .

DETAILED DESCRIPTION

The figures are only schematic in nature and serve only forunderstanding the embodiments. The same elements are provided with thesame reference symbols. The different features of the various exemplaryembodiments can also be freely combined with one another.

A power electronics unit 1 is illustrated according to a first exemplaryembodiment in FIG. 1 . The power electronics unit 1 is illustrated inFIG. 1 in different states of assembly, wherein the lower partialillustration shows the essentially complete power electronics unit 1.The power electronics unit 1, designed as an alternating currentconverter, is used during operation in a typical manner to convert adirect current predetermined by a battery on the input side into analternating current used on the output side to drive an electric motorof a motor vehicle drive train.

The power electronics unit 1 has an electrically conductive carrierelement 2, which in this embodiment is implemented in the form of a leadframe. The carrier element 2 also accommodates a power semiconductormodule 3. The power semiconductor module 3 typically has multiple powersemiconductors 6 which are embedded on a substrate 11, here a ceramicsubstrate. The power semiconductor module 3 is mechanically fastened tothe carrier element 2 and, with its power semiconductors 6, iselectrically connected to a current input and a current output viavarious conductor tracks, not shown here for the sake of clarity. Thepower semiconductor module 3 is implemented as an IGBT module. Thepre-assembly of the carrier element 2 with the power semiconductormodule 3 can be seen clearly in the upper partial illustration of FIG. 1.

The power electronics unit 1 has a current sensor 4, as shown in thecentral partial illustration of FIG. 1 . The current sensor 4 isintegrated directly into the power electronics unit 1. In particular,the current sensor 4 forms a common main module 5/electronics modulewith the carrier element 2 and the power semiconductor module 3. Thecurrent sensor 4, the carrier element 2 and the power semiconductormodule 3 are thus integrated into a modular system.

In this embodiment, the current sensor 4 is mechanically attachedindirectly to the carrier element 2 and to the power semiconductormodule 3. For this purpose, the current sensor 4 is, as can be clearlyseen in FIG. 2 , fastened to a conductor rail 7. For this purpose, anarea of the current sensor 4 having a chip 12 is electrically andmechanically attached/fastened directly to the conductor rail 7. Asensor housing 10 surrounds the current sensor 4 from the outside, sothat the current sensor 4 is closed off from the surroundings by thesensor housing 10. As also indicated in the central partial illustrationof FIG. 1 , the conductor rail 7 is electrically connected directly tothe power semiconductor module 3, namely a power semiconductor 6. Acommon type of connection, such as welding, soldering or other a similartype of connection, is typically used for this purpose. The conductorrail 7 is also preferably fastened to the carrier element 2.

In the finished state of assembly of the power electronics unit 1, whichis illustrated in the lower partial illustration of FIG. 1 , the powersemiconductor module 3 is additionally enclosed by a module housing 9.This module housing 9 is arranged spaced apart from the sensor housing10, i.e., the sensor housing 10 is arranged outside of the modulehousing 9. The module housing 9 completely accommodates the powersemiconductors 6 of the power semiconductor module 3. In particular, a(mechanical and electrical) connection point 13 between the conductorrail 7 and the power semiconductor 6/the power semiconductor module 3 isalso enclosed by module housing 9. The module housing 9 is showntogether with the power semiconductor module 3 and the carrier element 2without a current sensor 4 in FIG. 3 .

With regard to the shape of the carrier element 2, it can also be seenin FIG. 1 that this is essentially rectangular when viewed from above,i.e., when viewed in one plane. The carrier element 2 thus has arectangular outer contour 8. In this embodiment, the current sensor 4 isarranged partially overlapping with respect to this outer contour 8. Inparticular, the conductor rail 7 protrudes from an outside to an insideof the outer contour 8 to the power semiconductor module 3 over theouter contour 8.

According to the assembly process illustrated with the partialillustrations of FIG. 1 , in a first step, the power semiconductormodule 3 is first fastened to the carrier element 2 (upper partialillustration of FIG. 1 ). In a further step, the conductor rail 7together with the current sensor 4 is fastened to the carrier element 2and electrically and mechanically connected to the power semiconductormodule 3 (central partial illustration of FIG. 1 ). According to thelower partial illustration of FIG. 1 , the module housing 9 is finallyattached in a further step.

In connection with FIGS. 4 and 5 , further exemplary embodiments of thepower electronics unit 1 are illustrated, for which purpose only thedifferences from the first exemplary embodiment are described below forthe sake of brevity. The power electronics units 1 of FIGS. 4 and 5correspond in principle to the power electronics unit 1 of the firstexemplary embodiment in terms of function and construction.

The second exemplary embodiment is shown in connection with FIG. 4 .Here, the length of the conductor rail 7 is selected and the currentsensor 4 is arranged on the conductor rail 7 in such a way that thecurrent sensor 4 with its sensor housing 10 is arranged outside of theouter contour 8 with respect to the power semiconductor module 3.

According to the assembly process illustrated with the partialillustrations of FIG. 4 , the conductor rail 7 together with the currentsensor 4 is already fastened to the carrier element 2 before the powersemiconductor module 3 is attached to the carrier element 2 (upperpartial illustration of FIG. 4 ). After the conductor rail 7 ismechanically and electrically attached to the carrier element 2, thepower semiconductor module 3, as in FIG. 1 , is fastened to the carrierelement 2 and connected to the conductor rail 7 (central partialillustration of FIG. 4 ). In the lower partial illustration of FIG. 4 ,the module housing 9 is again attached according to the first exemplaryembodiment.

In this connection, it should be pointed out that, in a furtherembodiment, the conductor rail 7 and the carrier element 2 directly forma single component which is specially adapted to the power semiconductormodule 3. The process step of mechanically attaching the conductor rail7 to the carrier element 2 is thus eliminated.

Finally, FIG. 5 illustrates the third exemplary embodiment, which showsthat the current sensor 4 is in principle attached directly to thecarrier element 2. In this embodiment, the current sensor 4 with itschip 12 is applied directly to the carrier element 2. The current sensor4 is thus directly mechanically and electrically connected to thecarrier element 2 and indirectly electrically connected to the powersemiconductor 6 of the power semiconductor module 3. In this embodiment,a sensor housing 10 is eliminated, since the current sensor 4 isintegrated together with the power semiconductor module 3 into themodule housing 9. The current sensor 4 and the power semiconductormodule 3 are thus enclosed by a common module housing 9 (lower partialillustration of FIG. 5 ). The current sensor 4 is arranged inside theouter contour 8.

According to the assembly process illustrated with the partialillustrations of FIG. 5 , in a first step, the power semiconductormodule 3 is first fastened to the carrier element 2 (upper partialillustration of FIG. 5 ). In a further step, the current sensor 4 isfastened directly to the carrier element 2 and electrically connected tothe power semiconductor module 3 (central partial illustration of FIG. 5). According to the lower partial illustration of FIG. 5 , the modulehousing 9 is finally attached in a further step.

In other words, the current sensor 4 is applied to a unit 5 by means ofconnection technology or integration at the chip level with the powersemiconductor module 3. In principle, the following three variants I,II, II can be implemented.

Variant I (FIG. 1 ): Connection between the lead frame (carrier element2) and the conductor rail 7 of the current sensor 4 inside the powersemiconductor module (power semiconductor unit 1). The powersemiconductor (power semiconductor module 3) including the lead frame 2is manufactured as a unit. The current sensor 4, including the conductorrail 7, is led to the power semiconductor 3 and is directly electricallyand mechanically connected to the power semiconductor 3, for example bymeans of welding or soldering processes. A housing (module housing 9) isfinally applied around the power semiconductor 3 and areas of the leadframe 2 in order to protect the power semiconductors 6.

Variant II (FIG. 4 ): The current sensor 4 including the conductor rail7 and the lead frame 2. The current sensor 4 is installed on a leadframe 2 with an extended conductor rail 7. The power semiconductor 3 isconnected to the lead frame 2, for example, by means of solderingprocesses, welding or similar connection techniques. A housing 9 is thenapplied around the power semiconductor 3 and areas of the lead frame 2in order to protect the power semiconductors 6.

Variant III (FIG. 5 ): The integrated current sensor 4 in the powersemiconductor module (power semiconductor unit 1). The powersemiconductors 6 including the lead frame 2 are produced as a unit. Thecurrent sensor 4 is to be applied to the conductor rail 7 of the leadframe 2 without a housing (sensor housing 10). A housing 9 is appliedaround the power semiconductor 3, areas of the lead frame 2 and thecurrent sensor 4.

LIST OF REFERENCE SYMBOLS

-   1 Power electronics unit-   2 Carrier element-   3 Power semiconductor module-   4 Current sensor-   5 Main module-   6 Power semiconductor-   7 Conductor rail-   8 Outer contour-   9 Module housing-   10 Sensor housing-   11 Substrate-   12 Chip-   13 Connection point

1. A power electronics unit for an electric drive unit, the power electronics unit comprising: an electrically conductive carrier element; a power semiconductor module arranged on and directly fastened to the carrier element, the power semiconductor module is configured to convert a direct current into a three-phase alternating current; a conductor rail integrated with and directly connected on the carrier element and the power semiconductor module; and a current sensor configured to measure the alternating current and fastened directly to the conductor rail, wherein the carrier element is a lead frame.
 2. The power electronics unit according to claim 1, wherein the conductor rail is arranged to partially overlap a substantially rectangular outer contour of the carrier element.
 3. The power electronics unit according to claim 1, wherein the current sensor is arranged outside a substantially rectangular outer contour of the carrier element.
 4. The power electronics unit according to claim 1, wherein the current sensor is arranged partially overlapping with a substantially rectangular outer contour of the carrier element.
 5. The power electronics unit according to claim 1, wherein the power semiconductor module is enclosed by a module housing.
 6. The power electronics unit according to claim 5, wherein the current sensor is arranged in the module housing.
 7. The power electronics unit according to claim 5, wherein the current sensor is arranged in a sensor housing formed separately from the module housing.
 8. A drive train for a motor vehicle, comprising the power electronics unit according to claim 1 electrically connected to an electric motor.
 9. A power electronics unit for an electric drive of a motor vehicle, the power electronics unit comprising: a main module including: an electrically conductive carrier element; a power semiconductor module arranged on and directly fastened to the carrier element, the power semiconductor module is configured to convert a direct current into a three-phase alternating current; a conductor rail integrated with and directly connected on the carrier element and the power semiconductor module; and a current sensor configured to measure the alternating current and fastened directly to the conductor rail, wherein the carrier element is a lead frame; and wherein the main module is preassembled as a single unit.
 10. The power electronics unit of claim 9, wherein the conductor rail is arranged to partially overlap a substantially rectangular outer contour of the carrier element.
 11. The power electronics unit of claim 9, wherein the current sensor is arranged outside a substantially rectangular outer contour of the carrier element.
 12. The power electronics unit of claim 9, wherein the current sensor is arranged partially overlapping with a substantially rectangular outer contour of the carrier element.
 13. The power electronics unit of claim 9, wherein the power semiconductor module is enclosed by a module housing.
 14. The power electronics unit of claim 13, wherein the current sensor is arranged in the module housing.
 15. The power electronics unit of claim 13, wherein the current sensor is arranged in a sensor housing formed separately from the module housing.
 16. A drive train for a motor vehicle, comprising the power electronics unit according to claim 8 electrically connected to an electric motor. 